Normally, in
the production and assembly of electronic products, precise control of process
parameters is essential. Usually this process is done by continuous monitoring
and record process parameters which includes thermal profiling of PCBs. Basically,
thermal profiling of PCB’s involves controlling the temperatures during the
component soldering on the PCB.
What is Thermal Profiling for
Assembly?
The common
industry practice is to develop one of the three types of thermal profiles; it
depends on PCB size and largely on guesstimates. Its consequences include a
high probability of cold solder joints and damaged components. These issues
sometimes lead to inordinate extra re-work and assembly costs and OEM product
delays.
Also thermal
profiling of PCB’s or temperature profiling is very important for any
manufacturing process along with the heat treatment. Other than this it
involves plotting the temperature at numerous points on a given product as it
passes through thermal process. If you say typically, a thermal profile is a
complex set of time-temperature data. That is why, the thermal profile is all
about controlling the different dimensions like peak, soak, or slope, etc. that
usually affect the process. It is an important part of efficient PCB design
services that require advanced PCB manufacturing and assembly equipment.
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